Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Electromigration is one of the most important research issues affecting reliability solder joints. Current-induced Joule heating affects electromigration behavior Solder joints with different cross-sectional areas were designed to obtain properties. The effects interfacial intermetallic compound (IMC) and mechanical properties Sn58Bi/Cu studied for results showed that as area increased, joint increased. anode IMC thickness thickened transformed into a planar shape. Bi migrated region form Bi-rich layer gradually increased in thickness. cathode first then decreased, dissolved. Sn-rich formed near side thickness, microcracks occurring when 0.75 mm2. shear fracture path moved from soldering zone layer. mechanism changed mixed brittle/tough fracture, dominated by deconstruction secondary cracking, brittle deconstruction. strength was reduced 60.9% compared absence electromigration.